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Industry Directory | Manufacturer
VERSITRON'S reputation is unsurpassed in providing both reliable and transparent links between copper and fiber interfaces.
SN65LBC184DR 4.75V~5.25V 1/1 128 250kbps SOIC-8/-40~85
General Purpose (SMT): Silicon and Schottky Barrier Rectifier Diodes; MLV Transient Voltage Suppressors
Electronics Forum | Fri Oct 20 14:16:10 EDT 2006 | barryg
If it looks like 2 zener symbols tyed together at their cathodes I belive this is a avalanche diode or transient voltage suppressor (TVS). If you have a p/n you could do a search on like digikeys wesite and possible get an idea.
Electronics Forum | Mon Feb 08 23:44:31 EST 2010 | glennster
Woody, Daisy chain packages are definitely needed, but if you can get packages with a dummy chip inside these will provide a more accurate simulation of working components. If possible, continuous monitoring of resistance during the test will be
Used SMT Equipment | In-Circuit Testers
Tektronix SCD5000 High Speed Transient Digitizer This is a High Speed Transient Digitizer that was software equalized [11] to be 3db down at 16GHz, was used with the 12GHz one ohm resistor target to acquire different ESD waveforms. These two ver
Used SMT Equipment | In-Circuit Testers
Keithley 2657A Features: 1µs per point(1MHz)18-bit digitizer for accurately characterizing transient behavior Built-in "Plug & Play" Java-Based I-V characterization and test software TSP® (Test Script Processing) technology embeds
Industry News | 2003-06-25 12:28:40.0
The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.
Industry News | 2003-05-21 08:21:19.0
Basic concepts for identifying the relevant contributions to uncertainty, and the calculation of total uncertainty from these contributions
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
Technical Library | 2017-05-04 17:35:01.0
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.
A new task kit is available for LCR-Reader-MPA; the Professional. This bundle consists of and LCR-Reader-MPA, an NIST traceable calibration certificate, LCR-Reader Kelvin Probe Connector, spare bent tweezer tips, Offset Calibration Board, and chargin
>CONTACT MAC NOW Email: at@mooreplc.com Mobile: +8618020714662(Whatsapp) Skype: +8618020714662 >>>CONTACT MAC NOW ✦ Quick Details ✦ Brand:EPRO Part Number:A6560 Description:Transient Processor Card Condition:Brand
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/applications/dispensing-hot-melt-adhesive?con=t&page=28
: Dispensing - Hot Melt Adhesive Managing the Underfill Process in Transient Thermal Environments Nordson ASYMTEK S. Adamson, D. Ashley, W. Hassler, J. Wilburn (IMAPS Device Packaging Conference 2009
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Alternative solder alloys designed for higher temperatures are needed. Mathias Nowottnick of the University of Rostock will present on transient liquid phase sintering research by combining solid copper powder and liquidus SnAgCu solder
