We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
New Equipment | Coating Equipment
Conformal coating can be applied over the entire PCB surface or in select areas to provide protection from service environments.Materials are available for tin whisker mitigation, humid environments, and shadow areas.Selecting Coating Machi
New Equipment | Coating Materials
Conformal coatings for printed circuit boards cure tack free in seconds upon exposure to UV/Visible eliminating the time-consuming steps of traditional thermal-cure and room-temperature-cure conformal coatings. Coatings are available for tin whisker
Electronics Forum | Mon Apr 30 17:43:53 EDT 2012 | scottv02
I have heard there is a process for mitigating the pure tin issues for 0402/0201 size parts by the use of SN63/PB37 solder print process. Is this true and does anyone have the data to back this up?
Electronics Forum | Mon Apr 30 18:34:35 EDT 2012 | hegemon
Pure Tin terminations can be mitigated for components with solder terminations less than .030" in height from the PCB, by using 6 mil stencil with Sn63/pb37 solder paste. That's the simple story for our customers that require it. Beyond that height w
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2012-03-21 17:42:19.0
For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
https://www.ascen.ltd/Products/conformal_coating_equipment//580.html PCB Conformal coating machine is used to paint conformal coating onto full LED panel to avoid PCB moisture,sault and static.It can be full panel conformal coating or selective coati
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
| http://etasmt.com/cc?pageID=newsList&ID=te_news_bulletin,0&pNum=5
Vacuum Applications Show Details Key Advances in Void Reduction New advances in the reflow soldering process includingvacuum technology and warpage mitigation systems Show Details Component Cracking
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Yi Abstract 2016 29-3 Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package M. Neilsen and P. Vianco Abstract 29-3 Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors
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