Electronics Forum: through package vias (Page 1 of 66)

soldermask color change around vias

Electronics Forum | Fri Jun 07 10:46:16 EDT 2019 | gregoryyork

The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt

PBGA vias throwing solder balls

Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol

During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,

Mydata My12 package creation

Electronics Forum | Tue Oct 26 07:54:44 EDT 2010 | cyber_wolf

It's curious to us that you say creating packages on the Mydata's is time consuming. We have had Mydata's since the mid 90's and have only found this to be the case with odd form components. It will take you more time to search through someone else'

Spray flux through vias!!

Electronics Forum | Mon Sep 28 09:35:28 EDT 1998 | Clive Heke

I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it possib

through hole today

Electronics Forum | Thu Sep 12 11:27:21 EDT 2013 | rway

Yes. Typically terminals, large relays, displays, parts with mounted heatsinks. This is typically what you see on hand-insertion lines. Other parts with specialized packaging may not be able to be auto-inserted either. Most axial and radial leade

Stencil apertures for SOT639-2 package

Electronics Forum | Mon Feb 19 10:04:21 EST 2007 | realchunks

It's a nasty little part, but usuallu solders well. Now your inspectors will thing it's not soldered and try and touch it up, but generally, the exposed leads are not tinned, and will not toe fillet. If they know this up front they won't over heat

piercing of test vias at ICT

Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave

OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC

Plated through via's in pads.

Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills

Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t

Plated through via's in pads.

Electronics Forum | Wed Feb 05 19:43:34 EST 2003 | iman

If by the Powers Ta Be (customer/designer), you can't change the PCB design, negotiate for the PCB fab house, to block the via holes with their (green?) solder mask some customers/designers want to have via holes to be present in the PCB pad, due to

Plated through via's in pads.

Electronics Forum | Tue Jul 22 20:38:28 EDT 2003 | Paul T.

Have the PCB fabricator use a conductive paste to fill the vias and then finish by plateing over the via. Make sure it's coplanar to the side they're on, usually secondary side for discretes. PT

  1 2 3 4 5 6 7 8 9 10 Next

through package vias searches for Companies, Equipment, Machines, Suppliers & Information

Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
Conductive Adhesive & Non-Conductive Adhesive Dispensing

High Resolution Fast Speed Industrial Cameras.
Pillarhouse USA for handload Selective Soldering Needs

Easily dispense fine pitch components with ±25µm positioning accuracy.
High Throughput Reflow Oven

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...