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A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Fri Jun 07 10:46:16 EDT 2019 | gregoryyork
The Single Solder ball stuck to the mask may indicate undercured as well. The issue is not so much the mild No Clean flux but the potentially major active HASL flux or Silver Process chemistries causing issues. This has been through flow solder hasnt
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Used SMT Equipment | Coating and Encapsulation
Very Nice PVA 6000 For Sale Low Use - Like New Condition Year 2015 Set up for Dispensing but can be converted to a Conformal Coating PVA - Precision Valve and Automation Model Number: PVA6000 PVA-4x Optional Fourth Axis upgrade Included
Used SMT Equipment | Adhesive Dispensers
Very Nice PVA 6000 For Sale Low Use - Like New Condition Year 2015 Set up for Dispensing but can be converted to a Conformal Coating PVA - Precision Valve and Automation Model Number: PVA6000 PVA-4x Optional Fourth Axis upgrade Included SB30
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Parts & Supplies | Component Packaging
Standard: 4000pcs/box Brand: Introduce: 1)The shim includes holes to allow the material to go through the sprocket wheel of tape feeder and points to secure it to the carrier tape. 2)Brass shims with holes used together with tape splicing tool.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2019-05-21 17:38:55.0
Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Sarasota, Florida | Production
Operation of SMT equipment including Screenprinters, Chipshooters, Component Mounters, Reflow Ovens, etc. Set-up new jobs. Inspection to IPC-A-610 Class 2. Competitive wages and excellent benefit package. Qualified candidates may apply via email
Career Center | Charleston, South Carolina USA | Accounting/Finance,Engineering,Management,Production,Research and Development,Sales/Marketing,Technical Support
UEC serves the aerospace, military, industrial, and commercial markets by providing comprehensive product design, system integration, and vertically integrated manufacturing solutions including: hardware, software, and mechanical engineering; rapid p
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf
CF8 Documentation Package Documentation Package for CF-8 Axial Component Lead Former PN 801-1-01 version 2.0 03/22/2021 CONTENTS of CF-8 Documentation Package Operating Guide In addition to installation, set up, and operating procedures, this guide includes electrical schematics and maintenance
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_mounting-hole-vias-same-name_topic2256.xml
;For example, for a hole with six reinforcing vias, the main pad is named "1", and the vias are named "2" through "7." In Altium, to use this footprint, I would have to have a schematic symbol with seven pins, and connect to each of them
