New SMT Equipment: substrate (Page 1 of 78)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Benchtop Dispense Robots

Benchtop Dispense Robots

New Equipment | Dispensing

Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Volumetric Pump - PCD

Volumetric Pump - PCD

New Equipment | Dispensing

Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog

GPD Global

KE - 2070 JUKI high-speed chip mounter

KE - 2070 JUKI high-speed chip mounter

New Equipment | Pick & Place

Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

MPM UP2000 HiE Screen Printer

MPM UP2000 HiE Screen Printer

New Equipment | Solder Paste Stencils

MPM UP2000 HiE Screen Printer Substrate treatment                                                       Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+

New Equipment | Assembly Services

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function

KingFei SMT Tech

Panasonic NPM-W SMT machine

Panasonic NPM-W SMT machine

New Equipment | Pick & Place

Model name: NPM-W Substrate size Monorail * 1 Overall installation: L50mm×W50mm ~ L750mm×W550mm 2 positions: L50mm×W50mm ~ L350mm×W550mm Dual-track * 1 Monorail transmission: L50mm×W50mm ~ L750mm×

KingFei SMT Tech

YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE

YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE

New Equipment | Pick & Place

YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm     ~L510×W460mm Mounting efficiency 24000CPH/CHIP (

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Refurbished YAMAHA YV100xg Pick and Place Machine

Refurbished YAMAHA YV100xg Pick and Place Machine

New Equipment | Pick & Place

Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type  L460 * W335 (MAX) -L50 * W50 (MIN)   L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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