Variosystems is among the largest privately owned Contract Electronic Manufacturers worldwide. We offer complete turnkey solutions from engineering to systems integration and order fulfillment.
JUKI SMT Pick and Place Machine Surface Mount Technology System ❙ Introduce of JUKI RS-1R JUKI RS-1R is one of the new models of the JUKI Pick and Place Pachine, JUKI RS-1R smart modular mounter SMT Placement, JUKI SMT mounter, JUKI chip shooter,
Yamaha YSM20WR Modular SMT Placement ❙ Features of Yamaha YSM20R High-efficiency modular Yamaha SMT placement, Yamaha chip mounter YSM20R, applicable components 0201 to W55 x L100mm, Height 15mm or less, placement
Electronics Forum | Mon Sep 13 07:27:50 EDT 2021 | denism
There may also be a problem with the a thermoprofile. Measure the temperature of both contacts of the component, if they heat up not evenly and the soldered lead heats up faster, then the problem is in the profile. To solve the problem of misalignmen
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Pick and Place/Feeders
Here is your chance to purchase a Fully Automated SMT Line in Good Working Condition at a Low Price Cost new was over $1,000,000+ Million! Equipment consists of the following items DEK 265 GSX Stencil Printer - Green Camera -
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2019-10-15 15:04:38.0
A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming Productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high
Events Calendar | Tue Dec 08 00:00:00 EST 2020 - Tue Dec 08 00:00:00 EST 2020 | Online,
SMTA California Technology Day
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, April 16, 2020, Subscribers: 35,920, Companies: 10,989, Users: 25,757 Stencil Printing 008004/0201 Aperture Components Credits: ITW EAE This paper will focus on the application requirements of solder printing small aperture designs
SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
Heller Industries Inc. | https://hellerindustries.com/opensor-insufficient-solder/
stencil aperture Misaligned solder print Improper stencil thickness Inadequate stencil aperture size Excessive pad size Via in pad draining solder from interconnection Reflow-related causes of
