Industry Directory | Consultant / Service Provider
Serving the Educational Needs of Modern Technologies
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
SMT Lead Free Wave Soldering Machine XMW-350 Wave soldering advantages: ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes. Intelligent: intelligent control software, memory process parameters
SMT Lead Free Wave Soldering Machine XMW-450 Feature ▶Comprehensive: economical and power-saving type is suitable for various lead-free and lead-free processes Intelligent: intelligent control software, memory process parameters, automatic heating
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
PCB SMT Inspection Conveyor with Light If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coating conv
High-end SMT Inspection Conveyor If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coating conveyor, p
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Oakville, Ontario Canada | Production
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety o
Career Center | Oakville, Ontario Canada | Engineering,Production,Quality Control
Technicians / Technologists To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, February 19, 2015, Subscribers: 22,404, Members: Companies: 14,224, Users: 37,735 Numerical Study on New Pin Pull Test for Pad Cratering Of PCB Billy Hu, Jesus Tan - Flextronics Pad cratering is an important failure mode besides
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
failure. The failure mode remains solder fatigue, and the reduction in fatigue life is attributed to the geometric effect of reducing the crack path. These samples are two of the earliest failures in the 0/100 °C thermal cycling test, and it certainly is
