Microbond offers solder spheres in both SN62 and SN63 alloys and various sizes.
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Industry News | 2014-08-25 12:36:56.0
The Balver Zinn Group announces that it will exhibit in Booth #115 at SMTA International, scheduled to take place Sep. 30-Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2008-07-30 20:42:23.0
GREELEY, CO � July 30, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, premiers WS170 water soluble solder paste.
Technical Library | 2023-01-02 17:50:34.0
Silver bearing alloys have been used in electronics soldering for many years. Silver has been used in tin-lead solders (Sn62Pb36Ag2) to combat silver scavenging from silver plated electronic components as well as to improve thermal fatigue resistance. Many of the common lead-free alloys contain some amount of silver. Silver bearing alloys have good electrical and thermal conductivity as well as the ability to wet to the common surface finishes used in printed wiring assemblies, thus giving it all the attributes needed for an electronic solder alloy. Presence of silver in Sn based solders increases the bulk solder modulus and is generally believed to improve resistance to fatigue from thermal cycles. Increased solder modulus can be advantageous or disadvantageous depending on the desired performance attribute. For example in high strain rate situations, higher modulus of the bulk solders results in lower life time. A wide variety of leaded and lead-free
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– 500 gm Type-4 No-Clean Low Voiding Leaded Sn62/Pb36/Ag2 Solder Paste There are no videos yet There are no downloads yet More From Koki Established in 1964, KOKI have developed and introduced numbers
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. For 63Sn/37Pb solder paste with a melting point of 183℃ and Sn62/Pb36/Ag2 solder paste with a melting point of 179℃, the peak temperature is generally 210-230
