Electronics Forum | Mon Feb 12 02:17:32 EST 2007 | Wayne
Most of the semi-con is using SAC305 balls. Only the PCB assembly house feels the heat, but semi-con never feels any pressure.
Electronics Forum | Tue Feb 21 07:50:29 EST 2006 | Rizza
I'm also looking at this wireless wrist strap. try this website: http://www.esdjournal.com/techpapr/sfowler/wireless.htm for the evaluation of this strap.. well now..im looking for alternative that works the same in convenience but different in princ
Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne
I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA
Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn
hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee
Electronics Forum | Wed Oct 22 01:24:57 EDT 2008 | arosario
CK, I think electronic industry in Phils is still the same. What I hear is Vietnam or India are the target of the investors for electronic / semicon assembly.
Electronics Forum | Tue Jun 21 17:30:26 EDT 2011 | semiconjt
> Has anybody have eperience with stepped ( down and up )laser cutted stencils? >> What is manufacturing method of "patchwork" stepped stencils ?? Thanks Jacek Tomaszewski SEMICON Sp.zo.o -Poland
Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef
We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Sun Apr 04 15:33:01 EDT 2004 | Jimmy
We are looking at several reflow ovens with intent to acquire one for both air and nitrogen reflow capability (i.e. have the capability to reflow in either air or nitrogen environment). Would be interested to know what I should look for in comparing
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
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