Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Tue Sep 25 15:48:34 EDT 2001 | mparker
Scavenge all the old solder off the board and the chip. Micro screen paste to the chip. As far as thickness, check your aspect ratio to determine the spec. Eliminate just one variable at a time to get to the root cause. Start by not using the tacky
Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker
You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a
Electronics Forum | Tue Mar 15 22:04:56 EST 2005 | KEN
The hasl joint looks fuller (and is easier to inspect)because it has more solder volume. Think about it. Your pre-plating your board with solder (before you add more solder). I doubt your getting 0.3 mils of hasl.....probably more like 1.3 to 3.0
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
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