Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
With the EXOS 10/26, Ersa offers a vacuum reflow soldering system with eleven heating zones, three heating circuits for the vacuum chamber and four cooling zones for extremely voidfree connections in electronics production. The absolute highlight
Function Introduction: 1. TORCH promotes a new Vacuum Reflow Oven in RS series which is the third generation of its small Vacuum Reflow Oven. It especially designed for the fields in small batch production, R&D and functional materails test, etc
Electronics Forum | Tue May 07 10:13:06 EDT 2019 | cyber_wolf
I have personally never seen a reflow profile change reduce voids. We have invited "experts" in to demonstrate this claim. They were unable to.
Electronics Forum | Mon May 27 04:40:21 EDT 2019 | SMTA-Rogers
Dear Steve, We already to do some DOE of reflow profile, but the optimized parameters are not help for the reduction of voids.
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a
Heller 公司 | https://hellerindustries.com.cn/vacuum-oven-10-zones
Voidless Vacuum Reflow Oven With 10 Heated Zones » 无空洞/真空回流焊炉 » 1911MK5-VR 真空回流焊炉 1911MK5-VR 真空回流焊炉 无空洞真空回流炉 1911MK5-VR 适用于大批量生产，具有（10） 对流区和 （1） 红外加热区，加热长度为 364 厘米（143 英寸）。它始终如一地提供高水平的可重复性和低 ΔT，同时降低维护要求和拥有成本。 回流炉长度 590cm 工艺气体选项 空气、氮气、甲酸、合成气体 加热区 对流
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
. Transmission x-ray inspection shows substantially lower void content with vacuum assembly. Accelerated thermal cycling (ATC) is used to assess the solder attachment reliability of the air and vacuum reflowed test vehicles
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