YAMAHA YG200 is a high-speed SMD Surface Mounting machine, which has 4nos tables and totals 24 head nozzles, this machine mainly used for mount chip components, like 0201/0402/0603/0805/1206 or small QFN IC. “DONGGUAN KINGSUN AUTOMATION TECHNOLOGY
New Equipment | Board Handling - Storage
Solder paste printing range (1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes; (2) , IC: support SOP, T
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Tape and Reel Services
We offer tape and reel packaging services for standard or non standard SMD components. We provide as well customized carrier tapes for special components designed at our customers specifications Standard components: DDPAK DPAK SOP PLCC QFP QFN TO25
New Equipment | Tape and Reel Equipment
We supply the following material for tape & reel equipment : Pocket tape Cover tape Reels (all dimensions) We design customized pocket tape for any kind of components Standard components: DDPAK DPAK SOP PLCC QFP QFN TO252 TO263 SO SOS SOT
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Easy to program, this 5 Zone reflow oven has 3 upper and 2 lower heating zones. Great for assembly of circuit boards as wide as 11.5 inches. Reflow all types of components including LED's, BGA'S, LGA's, QFN's, Resistors, Caps and more! Best of all
