Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Industry Directory | Manufacturer
Manufacturer of convection reflow ovens, vapor phase ovens, convection curing, and IR curing ovens.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Type no ： K-MC8835 Heating parameters Number of heating zones：On 8 August Length of heating zone：2850mm Heating mode：Hot air Number of cooling zones ：1 Send some parameters Mesh belt width ：350mm Transport direction： Left and right Belt hei
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Fri Nov 19 05:12:21 EST 1999 | Graham Naisbitt
Steve, If you can get me your snail-mail address, I will send you some latest information. We actually have a totally new system called Delta 5. It is Condensation Soldering rather than Vapour phase, the difference being that we solder in an air ti
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Used SMT Equipment | Soldering - Reflow
2004 BTU Pyramax 150N X5 Reflow Oven 10 Zones (Top and Bottom Side Heaters) 2 Cooling Zones Edge Rail & Mesh Belt 7819 Operating Hours Nitrogen Capable Power: 380 / 220VAC; 3 Phase; 119A Machine Dimensions: 260" x 60" x 65"
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Parts & Supplies | Assembly Accessories
AXPC fan Assembly 949839603998 0.8M Linking Conveyor, Single Lane, for Cooling, with 6 Fan on Top MMLC-2103.8F 0.8m Linking Conveyor, without Fan MMLC-2103.8 1KURA FAN （for Samsung Reflow SRF70i82 ） U6250MKG1 1M Conveyor With
Parts & Supplies | Soldering - Reflow
Model : Heller 1809EXL Reflow Oven-1 Location：Shenzhen and Hongkong Vintage : 2006 Conveyor direction : Left to Right Board holding: Edge rail and mesh belt Air and nitrogen Power : 240V, 100A, 3-phase Condition : Very good
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Nano-copper sintering in formic acid vapor.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
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vapor phase reflow soldering. The reason for such defects is usually caused by the fact that the thermal conductivity of the relevant component leads is too high, and the temperature rises too fast, which causes the upturn of the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/1913-MarkIII-SPECS.pdf
Reflow Oven Specifications HELLER INDUSTRIES, INC. Heller Reflow Oven Specifications Model 1913 MARKIII (Air) 1913 MARKIII (Nitrogen) Electric Supply Power Input
