| https://www.eptac.com/faqs/soldertips/soldertip/acceptability-of-conformal-coating-bubbles
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
| https://www.eptac.com/soldertips/acceptability-of-conformal-coating-bubbles/
: We have some PCB cards that are flooded with champagne size encapsulated bubbles. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/minimum-trace-width-spacing-for-bga_topic1556.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/minimum-trace-width-spacing-for-bga_topic1556.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1556&OB=DESC.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1556&OB=ASC.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1556&OB=ASC.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/minimum-trace-width-spacing-for-bga_topic1556_post6321.html
) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see
| https://www.eptac.com/faqs/soldertips?hsLang=en
. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
| https://www.eptac.com/faqs/soldertips
. While no single bubble bridges between conductors there are numerous small bubbles similar to Figure 10-131 below, None have popped, as they are all encapsulated
