Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
Manufacturer of advanced process chemistry for plating, masking and stripping. Custom manufacturing of automated equipment for electrodeposion including; hoist systems, reel-to-reel and continuous vertical processing equipment.
0.2mm nickel silver copper rf PCB shielding can conductive soldering material China ISO manufactuer Any RFQ please send mail to us any time
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef
The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m
Industry News | 2013-02-08 14:38:34.0
IPC — Association Connecting Electronics Industries® launched a new series of monthly market research reports this week with the publication of the February 2013 edition of IPC Commodities Report for the Electronics Industry.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Parts & Supplies | Board Cleaners
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Parts & Supplies | General Purpose Equipment
The conductive elastomer have good conductive,and the products are mainly used in army electronic equipments like spaceflight,aviation,ect. We can produce this products according the drawing supplied by our customers. The materials: Silicon with Si
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
| https://pcbasupplies.com/sn100c-lead-free-bar-solder/
by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
27P00 45P00 Aluminum Non-solderable Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel Monel Nichrome Nickel Nickel
