Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
Industry Directory | Consultant / Service Provider / Manufacturer
Pandawill Circuits manufacture and supply a wide range of high quality PCB technologies, volumes, cost and manufacturing lead-time options based on our fundamental understanding of the PCB manufacture
Metal Covers are usually Kovar plated with Ni/Au. Covers are sealed to a ceramic or metal package, achieving a hermetic enclosure.
New Equipment | Fabrication Services
基材名称：陶瓷金属化基材的定制设计服务 基板材料厚度：0.635mm 导电层：Cu，Ni，Au 金属层厚度：300μm 表面处理：沉金 金属单面/双面：单面 镀铜通孔：无 阻焊膜：无
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Thu Oct 12 08:46:16 EDT 2000 | T Jones
Several online PCB fabrication quote forms offer SMOBC as a surface finish along with HASL, Ni/AU, etc. How does one specifify SMOBC for traces and untented vias, and elctroless Ni/Au for smt pads? Are these processes mutually exclusive? Or can I g
Industry News | 2020-03-19 13:12:42.0
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Industry News | 2014-02-03 14:13:04.0
FCT Assembly is pleased to announce that it now offers a variety of anti-tombstoning solder pastes as an option with each of its solder paste fluxes.
Parts & Supplies | Storage Equipment
Battery Specification Battery Type Li(NiCoMn)O2 Battery Pack 1. Basic Information Serial Number ZBL-HY001K 48V10A Connection Type 13S4P Dimension(L*W*H) 360*130*65mm Weight ≥5kg 2. Battery pack(cell) Technical Datas Battery Model 18650/260
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Hyland; Agilent Au over Ni on Cu is a widely used p
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-research-evaluates-the-effects-of-rf-plasma-processing-prior-to-conformal-coating
(formerly known as Desich SMART Center). The paper can be downloaded here . The objective of the experiment was to evaluate the effects of RF plasma processing on the conformity of coverage of conformal coating of the knee of individual Nickel-Palladium-Gold (Ni-Pd-Au
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
to be joined using sTIM are usually gold, with the silicon backside typically being PVD-deposited Ti/NiV/Au (80-200nm Au), and copper heatspreader/lids plated with Ni/Au (usually with 0.3-0.8um Au). Except for the inevitable presence of a film of
