Industry News: multilayer ceramic capacitor (Page 1 of 6)

KEMET Names Graves President and Chief Executive Officer

Industry News | 2003-03-26 08:43:33.0

Dr. Jeffrey Graves has been named President and Chief Executive Officer, effective immediately.

SMTnet

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

SMTnet

Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

SMTnet

KEMET Announces Enhanced Strategic Plan

Industry News | 2003-07-10 08:36:25.0

To execute this strategic plan, KEMET is reorganizing its operations around the world.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Best Technical Papers at IPC APEX EXPO 2023 Selected

Industry News | 2023-01-16 07:35:11.0

The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.

Association Connecting Electronics Industries (IPC)

IPC’s NCEDAR CONFERENCE AIMS TO BOOST INDIA’S ELECTRONICS INDUSTRY

Industry News | 2012-11-27 15:24:14.0

IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.

Association Connecting Electronics Industries (IPC)

How to choose Automatic Insertion Machine?

Industry News | 2023-05-27 08:28:25.0

Axial insertion machines are used for components with leads that are parallel to the PCB, while radial insertion machines are used for components with leads that are perpendicular to the PCB.

I.C.T

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

Award for New Product Innovation Announced

Industry News | 2016-04-20 10:27:40.0

BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.

BEST Inc.

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