Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Industry Directory | Manufacturer
Electronic Manufacturing Services provider from Design to Prototypes and production including cable, electro mechanical assemblies and Box builds
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
Electronics Forum | Tue Jul 31 22:42:41 EDT 2001 | chip
In the past I have spoken to Multitronics sales reps and looked into the product line. I saw their equipment more suited for a smaller "mom and pop" type shop, I work for a mid size contract house and it wouldn't have come close to meeting my needs.
Electronics Forum | Fri Sep 07 14:51:36 EDT 2001 | Claude Couture
What kind/brand of machine are we talking about? Are the missing parts randomly distributed or are specific to a feeder/placement/pattern? Does your machine remember where to resume placement if you reset it in the middle of a pattern placement? We h
Used SMT Equipment | Chipshooters / Chip Mounters
Good News! To express our gratefulness to all our customers, a series of promotional activities will be held in June by our company. The mid-machines and low-machines in our factory are on sale. Action now！！！！
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Parts & Supplies | Component Packaging
SAMSUNG FN-14 J7055336A SAMSUNG FN-08 J7055335A SAMSUNG FN-05 J7055334A SAMSUNG AIR TUBE (POLYURETHANE) TU0604B J6713030A SAMSUNG AIR TUBE UB1065B J6713013A SAMSUNG AIR TUBE (POLYURETHANE) TU0805B J6713027A SAMSUNG BALL SPLINE UNIT Z-AXIS J6611
Parts & Supplies | Pick and Place/Feeders
J31521026A SP1 STEP MOTOR DRIVER 4AXIS MD2B-SD15-4X Other Samsung parts: SAMSUNG FN-14 J7055336A SAMSUNG FN-08 J7055335A SAMSUNG FN-05 J7055334A SAMSUNG AIR TUBE (POLYURETHANE) TU0604B J6713030A SAMSUNG AIR TUBE UB1065B J6713013A SAMSUNG AIR
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
SMTnet Express, December 7, 2016, Subscribers: 27,507, Companies: 15,035, Users: 41,441 Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/Island-Series-System-Overview.pdf
. Precision Auger Pump Low-to-mid viscosity. Underfill, Chip On Board Encapsu- lation, SMT Glue, UV Glues Jetting Pump (NCM5000) Full range of fluid viscosities
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/software?con=t&page=10
) Nordson ASYMTEK Infinit-Manual-Short-GSM-28V24R14-Eng Nordson ASYMTEK Precise, high-throughput underfill dispense in chip-on-wafer packaging Nordson ASYMTEK H. Liang
