The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering system is designed to deliver maximum thermal per
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Used SMT Equipment | Soldering - Reflow
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
Used SMT Equipment | AOI / Automated Optical Inspection
VI Technologies 3D AOI machine (2016) Type: 5K SPECTRO Large Board AOI Solution 230V, 690 Watts, 3 Amps, 50 Hz lightly used unit 3D Single Lane Automated Optical Inspection System Precision XY gantry High-speed linear motors with closed loop
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
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Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
thermal expansion (CTE) mismatch between the package and the PCB [20, 21]. The CTE of the PCB was measured using a thermomechanical analyzer (TMA) and the composite coefficients of thermal expansion of the 192CABGA and 84CTBGA packages were measured using
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