New Equipment | Test Equipment
Localized Electronics Cleanliness Tester and Residue Extractor The information gathered when using the C3 is intended to provide a measure of the cleanliness of a localized region of a circuit board. In addition, the C3 extracts a sample of the effl
New Equipment | Industrial Automation
Contact us if the item you are urgent.Often we have large stack to meet you needs ! mailto:unity@mvme.cn Contact: Sandy Lin mailto:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 M
Electronics Forum | Mon Feb 25 21:13:12 EST 2002 | davef
No, none of us can tell you what is the acceptable level of halide content or contamination in flux residue. The level of harmful residues on your product helps determine the reliability of your product. We know nothing of your product, its custome
Electronics Forum | Mon Feb 25 15:09:06 EST 2002 | jax
Kelvin, You can find the Standard acceptable levels and testing procedures from IPC. Here's a little advice from the fellas' over at PCFAB: As a guideline, we recommend that for assemblies processed with low-solids flux technology and that are not cl
Used SMT Equipment | General Purpose Test & Measurement
Stanford Research SR785 The Stanford Research SR785 Two-Channel Dynamic Signal Analyzer is a precision, full-featured signal analyzer that offers state-of-the-art performance at a price that's less than half that of competitive analyzers. Buildin
Industry News | 2012-10-22 18:41:47.0
IPC and SMTA jointly announce the agenda for Session 3 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2012-10-22 18:42:04.0
IPC and SMTA jointly announce the agenda for Session 3 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
SMTnet Express, Septemeber 8, 2016, Subscribers: 26,370, Companies: 14,943, Users: 41,052 How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR? Terry Munson, Paco Solis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
activators. RA flux has higher activity than RMA for moderately oxidized surfaces. Most RA flux residues are corrosive and should be removed. Maximum safe time before cleaning is product dependent. Residue may be removed with an appropriate solvent. Rosin
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
placed in the Electrovert Aquastorm 200 in-line cleaning system for removal of solder flux residues and other contaminants from the assembly. The in-line cleaner utilized 13.5% (by volume) Kyzen Aquanox 4625 saponifier in deionized water. The in-line
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