Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
We Offer: Robotic and semi-automatic hot solder dipping, Precision lead forming of critical devices, Tape-and-reel packaging, State-of-the-art Ball Grid Array (BGA) reflow process
New Equipment | Coating Equipment
Conformal coating can be applied over the entire PCB surface or in select areas to provide protection from service environments.Materials are available for tin whisker mitigation, humid environments, and shadow areas.Selecting Coating Machi
New Equipment | Assembly Services
TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
Electronics Forum | Thu Aug 05 14:45:03 EDT 2004 | davef
Bright vs matte tin is fairly easy, but there's a s whole bunch of alternatives, beyond those two choices. So, no, not that we know.
Industry News | 2012-03-26 15:58:58.0
Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.
Industry News | 2013-10-01 18:21:25.0
IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
Technical Library | 2020-07-01 19:45:04.0
A company approached ACI Technologies (ACI) for assistance with a new product that was about to undergo its initial proof-of-concept prototype build. This product was an item that was being furnished to the Department of Defense for a program designed to increase the technical capabilities of computer equipment issued to the war fighter. The requirements for this item specified the use of tin-lead solder during assembly of production units. One of the main responsibilities for ACI during this project was to assist the client in mitigating the risk introduced using commercial off-the-shelf materials that may be lead-free.
https://www.ascen.ltd/Products/conformal_coating_equipment//580.html PCB Conformal coating machine is used to paint conformal coating onto full LED panel to avoid PCB moisture,sault and static.It can be full panel conformal coating or selective coati
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
: White Insulating Layer Finish: Matte or Polish Standard Roll Widths: up to 48” wide Standard Gauges (insulating layer): 0.005”, 0.010”, 0.015”, 0.020”, 0.030” Available Foils: Aluminum, Copper, Tin Plated Copper
| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf
” 4 J-STD-001/610 • Tin mitigation plan according to GEIA- STD-0005-2 will be necessary, or have some plan identifying how it is being handled by the industry • The question is
