Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Cleaning Equipment
In-line technologies in a batch footprint. Today’s challenges for PCB manufacturers hinge on high density, increasing complexity, and miniaturization. Manufacturers who currently clean with batch-type cleaners are looking for a solution
Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Mon Oct 31 13:31:19 EDT 2011 | davef
We're not sure what a 'sticky roller' is, but will it: * Remove ionic materials * Leave no residue * Clean the walls of through holes and vias * Clean under low stand-off BGA and LGA
Industry News | 2013-01-17 11:15:42.0
One of the “cleanest” areas on the IPC APEX EXPO® show floor will be found at the IPC/NPL Cleaning and Contamination Testing Center
Industry News | 2018-09-05 20:22:26.0
ITW EAE will be demonstrating its Electrovert Inline cleaning equipment at a joint workshop hosted by Electrovert and Zestron. The workshop will take place October 11-12 at Zestron’s Technical Center in Ingolstadt, Germany. Participants will have a unique opportunity to learn first-hand from cleaning technology experts and observe the entire cleaning process and cleanliness evaluation. The event will offer an exchange of knowledge and networking with others who have similar cleaning challenges.
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072419-lubrication-systems-standard-vs-low-volume-low-pressure
Lubrication Systems: Standard vs. Low Volume Low Pressure Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
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