Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
Multilayer PCB Stackup Planning Multilayer PCB Stackup Planning Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate can
Application Of Build-in Self Test In Functional Test Of DSL SMTnet Express May 23, 2012, Subscribers: 25234, Members: Companies: 8880, Users: 33129 Application Of Build-in Self Test In Functional Test Of DSL First published in the 2012 IPC APEX
Environment First published in the 2012 IPC APEX EXPO
SMTnet Express, January 17, 2019, Subscribers: 31,198, Members: Companies: 10,693, Users: 31,603 IPC APEX EXPO 2019 - TECHNOLOGY'S FUTURE COMES TOGETHER Why Attend IPC APEX EXPO 2019? Because IPC APEX EXPO
SMTnet Express, December 12, 2019, Subscribers: 33,007, Companies: 10,941, Users: 25,408 IPC APEX EXPO 2020 – Celebrating 20 Years of Excellence in Electronics This year marks the 20th anniversary of IPC APEX EXPO and IPC is thrilled
SMTnet Express, January 25, 2018, Subscribers: 31,198, Members: Companies: 10,865, Users: 24,319 SUCCEED AT THE VELOCITY OF TECHNOLOGY IPC APEX EXPO 2018 Attendees Can Succeed at the Velocity of Technology at Free Networking Events From the exhibit
IPC is the trade association for the printed wiring board and electronics assembly industries.
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