Industry News: intermetallic (Page 1 of 12)

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Industry News | 2018-04-09 19:48:04.0

SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA Announces Best Paper from 2015 Pan Pacific Symposium

Industry News | 2015-03-23 12:45:11.0

The 20th Annual Pan Pacific Microelectronics Symposium held February 2-5, 2015, at the Sheraton Kauai Resort highlighted more than 50 papers from 14 countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

Surface Mount Technology Association (SMTA)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab

Industry News | 2014-01-29 10:18:33.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter March Meeting to Feature Nanosolder Expert

Industry News | 2014-02-19 16:47:48.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723.

Surface Mount Technology Association (SMTA)

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Industry News | 2019-01-30 08:13:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

IPC HONORS BEST PAPERS AT IPC APEX EXPO 2010

Industry News | 2010-04-10 02:45:03.0

IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Best Papers from SMTA International Announced

Industry News | 2024-02-05 14:05:05.0

The SMTA is pleased to announce the Best Papers from SMTA International 2023. The winners were selected by members of the conference technical committee. This year awards were given for the "Best of Proceedings" category but also for a new designation of "Best Practical and Applications-Based Knowledge." A plaque is given to primary authors of all winning papers for these exceptional achievements.

Surface Mount Technology Association (SMTA)

BEST SMT Boot Camp Nov 29-Dec 1, 2016 Featuring Phil Zarrow

Industry News | 2016-10-25 09:47:33.0

Learn about SMT assembly from SME Phil Zarrow in Chicago

BEST Inc.

Nihon Superior's Keith Sweatman to Present at TMS Annual Conference

Industry News | 2012-02-15 19:03:23.0

Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.

Nihon Superior Co., Ltd.

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