Electronics Forum | Fri Jan 29 12:04:13 EST 2010 | davef
In response: * We know of no "videos about Pb-Cu intermetallic." Intermetallics are usually observed in microsections of solder connections. * We are unaware of "Pb-Cu intermetallic." In most soldering results in a copper-tin intermetallic. * Trainin
Electronics Forum | Thu Jan 28 20:22:24 EST 2010 | rbortoli
Hi my name is Renato and I am from Brazil, and I would like to know where I can find some videos about Pb-Cu intermetallic and rework in SMT.
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Thu Apr 09 00:35:06 EDT 2009 | padawanlinuxero
Hello! I am in a little problem, theres a problem in one of the components, is a new component that we are working with the leads are tin coated, and after we solder in the reflow oven, with lead solder, we took them to do a some test and on a cros
Electronics Forum | Wed Aug 24 16:30:48 EDT 2005 | davef
Optical microscope or SEM work fine. You say, "I have found out that the method of measuring intermetallic compound(IMC) formation is quite questionable." What's the issue?
Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is
Electronics Forum | Wed Aug 24 08:54:30 EDT 2005 | patrickbruneel
SEM to determine thickness and spectrum analyses to determine the metals forming the IMC. This will give you everything you would want to know.
Electronics Forum | Thu Aug 25 04:55:32 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, Whenever I'm measuring IMC using the optical microscope, I have to make sure that the images captured are clear. If not, then i will have an issue in differentiating the blurry areas between the IMC and solder(for example). This gives variatio
Electronics Forum | Mon Sep 18 18:17:56 EDT 2017 | chintan
IS there an IPC standard or equivalent which specifies the maximum thickness of intermetallic compounds (IMC) in a reliable solder joint?
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
