Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Thu Oct 01 08:19:34 EDT 2015 | sankarseptember
Hi guys I am from India.We are using Yamaha X ray inspection machine. Is there any government statutory requirement for using this X ray machine?
Electronics Forum | Mon Oct 12 04:55:54 EDT 2015 | akon63
Hiiiii The X36 Series encapsulates the most advanced development in x-ray imaging technology on the market with a full set of inspection tools, providing outstanding detection sensitivity for contamination detection and product integrity checks. V
Used SMT Equipment | X-Ray Inspection
Make: YesTech Model: YTX-X3 Vintage: 2008 Description: Inline 3D AXI Condition: Complete & Operational Pictures: https://www.dropbox.com/sh/nazwndwznon7j5k/AAD24JIFsV6vbKWZN4xP_9nBa?dl=0 Location: Florida, USA
Used SMT Equipment | X-Ray Inspection
Focal Spot Inc, x-Ray Station, Model FSX-960, MFG: Dec 2005, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2015-09-30 16:50:32.0
MIRTEC and YXLON were awarded Best Innovation by SMT Today Magazine for the joint development of the SmartLoop yield improvement system during the recent SMTA International Conference & Exhibition. The award was presented to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division, and Keith Bryant, Sales Director for SmartLoop, on Tuesday, September 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The ‘Best Innovation Award’ recognizes clear visionary and transformative technology within the electronics manufacturing industry. This award showcases innovations that have not only addressed a need and solved a problem, but have also been used to drive improved efficiency and productivity of an organization.
Parts & Supplies | Pick and Place/Feeders
SAMSUNG SMT MARGINAL RAY CP40LV VACUUM GENERATOR More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X
Parts & Supplies | Assembly Accessories
DEK SMT Original used solvent-way valve Part Number : 190216 Description: DEK solvent-way valve FITTING AIR UNION INLINE 6MM (TXT) Part NO.: 190216 More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D2
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Mon Nov 25 00:00:00 EST 2019 - Mon Nov 25 00:00:00 EST 2019 | ,
Webinar: Overcoming Challenging X-Ray Problems
Events Calendar | Thu Feb 15 00:00:00 EST 2024 - Thu Feb 15 00:00:00 EST 2024 | Dayton, Ohio USA
Ohio Valley In-Person Technical Meeting: Extracting Value from SPI, AOI and X-Ray Technologies
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Madison, Alabama USA | Engineering,Production
Performs electronic assembly functions on an as needed basis. Performs rework/replacement/placement operations on BGAs using various rework systems without doing damage to the assemblies. Performs X-ray inspection of BGAs using CRX-2000 real time
Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,
Career Center | Grand Rapids, Michigan USA | Engineering,Maintenance,Management,Production,Research and Development,Technical Support
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