Electronics Forum | Mon May 23 08:22:31 EDT 2005 | davef
Thermal mass is the ability of a material to absorb heat energy. * A lot of heat energy is required to change the temperature of high density areas, like a ground plane. They are therefore said to have high thermal mass. * Light weight areas, such as
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Mon Mar 27 20:59:41 EST 2000 | Dave F
Garo: Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherwise, on voids--nor should there be. See also J-STD-013,
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko
Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse
Electronics Forum | Thu Nov 20 14:49:54 EST 2014 | joe98375
Greetings, I am looking into buying a wave solder machine for medium production of 100% through hole boards (~8.5"X12" dimension, not many layers, no high density part areas,
Electronics Forum | Fri May 17 11:10:25 EDT 2002 | wister
Is there any software to design the stencil openings? It may be including automatic modify the aperture,monitoring aspect ratio and area ratio,even let you know the whole vloume of the opening and average ratio?because the stencil design is more impo
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn
| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going
