New Equipment | Rework & Repair Equipment
Semi automatic bga rework station machine to desolder and solder chip on mobile pcb Features: 1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled; 2. Movable heating head,which can be moved
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc
Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI
Electronics Forum | Wed May 21 09:03:52 EDT 2008 | bing007
I have been confronted with a MPM with a rheometric pump head on and have not had much to do with these. It is giving varying results on the down line paste AOI and is not responding very much to changes in pressure, speed etc. It is a 16inch pump, w
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
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Parts & Supplies | Pick and Place/Feeders
Yamaha main stopper on YV100II KU0-M9160-01X Yamaha parts: 1 KV7-M9161-00X PLATE,STOPPER 1 2 KV7-M9162-01X BRKT.,STOPPER 1 3 KV7-M9163-00X STOPPER 1 4 KV7-M9164-00X BRKT.,CYLINDER 1 5 KV7-M9165-01X CYLINDER:PDAS6X40 1 6 KV7-M9166-00X GUIDE (LW
Parts & Supplies | Assembly Accessories
Yamaha feeder in stork: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-000 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Technical Library | 2019-05-24 09:22:59.0
There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/uc205-pillow-block-227935?page=11&order=list_price+desc
Pillow Block | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Pillow Block Public Pricelist Public Pricelist Pillow Block
| https://www.feedersupplier.com/sale-14347874-universal-ai-head-2-on-21307107-smt-ai-machine-spare-parts.html
Universal AI HEAD 2 ON 21307107 SMT AI Machine Spare parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
