Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
HASL - WHAT A HASSLE, or HASL'd AGAIN. If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ Featured Article HASL - WHAT A HASSLE, or HASL'd AGAIN. Proof Of Design MoonMan This article updates
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Procured test board with bare copper pads protected with OSP. (Future testing to be run with HASL Lead Free Pads) ♦ Tested 2 pastes: ♦ 96.5% Sn/3.5% Ag with RMA flux melt point 221
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
copper/intermetallic interface without any signs of grain boundary attack was detected. The mechanisms themselves occur in series and the slowest one determines the overall kinetics of the process. The most general dissolution rate equation is shown below8
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