New Equipment | Cleaning Equipment
SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~
New Equipment | Cleaning Equipment
SMT PCBA In-line Cleaning Machine SME-6200 PCB width 50~600mm Conveyor net speed 100~1500mm/min Clean tank 300L Machine weight 2000KG Product description: SMT PCBA In-line Cleaning Machine SME-6200, PCB width 50~600mm, Conveyor net speed 100~
Electronics Forum | Fri Oct 19 11:51:25 EDT 2007 | rgduval
By definition, no clean solder can be not-cleaned. The solder/flux are formulated to result in low ionic-contamination, hence, no cleaning. I have, however, always had at least one customer that requests their no-clean solder get cleaned. No-clean
Electronics Forum | Fri Oct 19 13:57:17 EDT 2007 | Michael Konrad
Hi Rob, I must take issue with your statement �By definition, no clean solder can be not-cleaned�. All no-clean fluxes can be cleaned. Whether or not one cleans no-clean depends on a variety of factors. More than eighty percent of all post reflow
Industry News | 2009-09-17 14:07:15.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with Ning-Cheng Lee, Ph.D., Indium Corporation and Steve Stach, Austin American Corporation, will hold a presentation titled “Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2018-04-25 20:16:44.0
KYZEN today announced that Mike Bixenman, DBA, will present at the SMTA Medical Electronics Symposium, scheduled to take place May 16-17, 2018 at the University of Texas at Dallas. In addition to the presentation, Jack Reinke, KYZEN cleaning expert, will be at table #8 during the Expo. Reinke will be available to meet with attendees to answer cleaning process questions.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
SMTnet Express, Septemeber 8, 2016, Subscribers: 26,370, Companies: 14,943, Users: 41,052 How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR? Terry Munson, Paco Solis
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. Prevents ionic contamination Polar or ionic particles left over from flux residues and other sources, when exposed to moisture in ambient air and an electrical current are applied, can connect into
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
has returned to room temperature. k. There shall be no dewetting of the solder on the cable conductor or on the connector. l. The supplier shall clean all surfaces with an approved solvent until they are free from all residual flux and other visible
