Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Industry News | 2013-07-24 16:39:34.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Industry News | 2013-07-24 22:01:53.0
IPC — Association Connecting Electronics Industries® announces that IPC APEX India™ will offer a comprehensive program of both half- and full-day workshops designed to help engineers find solutions to their most pressing concerns in electronics manufacturing.
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
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SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit
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