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SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

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SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

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: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing. Have you ever seen this and if so, what is allowed or acceptable according to IPC standards, even with the lack of verified electrical failure of these components? Answer

Lab Services Quote

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/lab-services-quote

? Device Information Part/Device * Quantity Objective (Choose one) Failure analysis Production screening Construction analysis Device qualification Process control/development R & D Screening

ASYMTEK Products | Nordson Electronics Solutions

Materials an Composites

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/materials-and-composites

) techniques detect these material-weakening flaws better than any other inspection method. Sonoscan systems nondestructively inspect materials layer by layer, delivering accurate and comprehensive analysis for product development, failure analysis and process control insights

ASYMTEK Products | Nordson Electronics Solutions

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