New SMT Equipment: enig snpb (2)

Rigid PCB

Rigid PCB

New Equipment | Fabrication Services

Our Capability: Eastech Group has 1-30 layers of production technology, we are committed to manufacturing high precision multilayer circuit boards, HDI boards and other products, and has rich production experience in Thick board, Thin board , Heavy

Eastech Group Circuit Technology (ShenZhen) CO., LTD

Printed Circuit Boards Fabrication.

Printed Circuit Boards Fabrication.

New Equipment | Fabrication Services

High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi

i3 Electronics

Electronics Forum: enig snpb (24)

ENIG reflow

Electronics Forum | Mon Jul 12 05:54:34 EDT 2010 | xps

Hi everyone, someone knows the correct parameters for reflow the smt devices using SnPb on ENIG finishing ? Someone suggest to use more temperature than others finishing, cause nickel barrier. Someone can confirm this ? There are handbooks or articl

Gold versus HASL finish

Electronics Forum | Tue Mar 15 17:58:56 EST 2005 | darby

Mat, Are you sure you should be using SnPb HASL boards if you are doing prep for lead free? If you aren't actually going to comply with RoHS then fire away. Nearly all of our assemblies are now ENIG and as any re-design comes up on a HASL board it is

Industry News: enig snpb (4)

Practical Components Expands Product Offering with SMTA Solder Paste Test Vehicle for Miniaturized SMT Optimize the stencil printing and reflow portions of SMT assembly with this SMTA test vehicle.

Industry News | 2019-04-03 20:07:41.0

Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.

Practical Components, Inc.

Indium Corporation Introduces New Fast-Wetting, Low-Spatter Flux-Cored Wire for Robotic and Laser Soldering

Industry News | 2021-01-21 08:09:52.0

Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.

Indium Corporation

Technical Library: enig snpb (3)

Creep Corrosion of PWB Final Finishes: Its Cause and Prevention

Technical Library | 2021-04-08 00:30:49.0

As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion

Alcatel-Lucent

Gold Embrittlement In Lead-Free Solder.

Technical Library | 2014-08-07 15:13:44.0

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.

DfR Solutions

Express Newsletter: enig snpb (75)

Partner Websites: enig snpb (5)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

] Investigation Specifics:  Variety of BGAs and CSPs, daisy chained, various solder ball diameters  SnPb and SAC solder pastes  Test vehicle one: 2.36mm thick (93 mil), FR-4, 6 internal planes

Heller Industries Inc.


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