Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon
| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over
Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F
Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the
Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon
| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s
Electronics Forum | Thu Jun 14 04:24:32 EDT 2012 | brettrenishaw
Yes pads are still gold after the wave soldering process even if you wave solder a pcb several times. I have tried soldering using an iron and the solder takes to the pad as you would expect. This happens on all boards of this type and all boards are
Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis
PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
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