Industry Directory | Consultant / Service Provider / Manufacturer
Innoventions manufactures the RAMCHECK LX line of benchtop DRAM memory test equipment for servers, desktops and laptops. RAMCHECK LX will test DDR4, DDR3, DDR2, DDR, SDRAM, including SO-DIMM and DIMM.
esd package (electro-static dissipating) antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: for 10 long dimm / 20 so dimm
esd package electro-static dissipating antistatic for dram module ddr3 ddr2 ddr1 sdr long dimm so dimm micro dimm fb dimm Specification: combo for long dimm / so dimm Made by SHINLY plastics corporation www.shinly.com.tw
Electronics Forum | Tue Nov 19 10:39:11 EST 2019 | cmchoue
Hi Experts, If SMT Type DDR DIMM Socket , PTH Pin size:2.5mm , PCB hole 2.45mm, Could this design can use placement machine to put DIMM on PCB? How to overcome the interference between PTH pin and PCB hole? Thank you Best regards James
Electronics Forum | Mon Jul 30 16:26:45 EDT 2012 | rdouglass
Just curious if anyone else has trouble with the installation and inspection of DIMM Connectors (I know - these are through-hole parts!) We have boards with 240 pin DIMM connectors and occasionally a pin may not be properly aligned prior to press-f
Used SMT Equipment | Pick and Place/Feeders
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
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Used SMT Equipment | Pick and Place/Feeders
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
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Parts & Supplies | Pick and Place/Feeders
JUKI 2010 2020 2030 CPU Card ACP-122J E96567290A0 E9656729000 Other juki parts: E9601725000 PANEL COMPUTER(UPL5700T-JU1) →40018945 E9601729000 CPU BOARD →E9656729000 E9601750000 I/F CABLE 34P E9601802000 PANEL COMPUTER (8M)(UPL5700T-JU2) →400189
Parts & Supplies | Pick and Place/Feeders
JUKI 750 760 display with CPU set Condition: original used & working well E9601855000 LENS UNIT E96018550A0 0.75X UPPER AND LOWER UNIT E9602715000 OPERATION PANEL E96027160A0 PHOT SENSOR E9602721000 FDD I/F PWB E9602725000 DIMM MEMORY 4MB E960
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Career Center | San Jose, California | Management
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #6 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | , | Production
Company: Ma Labs Inc. Headquartered in San Jose, as a leading PC component distributor & rank #5 DRAM manufacturer in the worldwide, Ma Labs Inc. has specialized in memory modules since 1985. We provide a full range of memory modules from RDRAM, DDR,
Career Center | Toronto, Ontario Canada | Engineering,Production,Purchasing,Sales/Marketing
A dedicated professional with 17+ years of experience in product management, marketing, project management, engineering and manufacturing. Demonstrated ability to interact with customers and manage cross-functional teams to drive business growth. 4+
