Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
Qualitetch utilse photo etching, wire EDM, laser cutting, metal forming, machining to offer the "Total Metal Component Solution" to customers requiring thin gauge metal components in most metals.
0.2mm nickel silver copper rf PCB shielding can conductive soldering material China ISO manufactuer Any RFQ please send mail to us any time
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef
See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Industry News | 2013-02-08 14:38:34.0
IPC — Association Connecting Electronics Industries® launched a new series of monthly market research reports this week with the publication of the February 2013 edition of IPC Commodities Report for the Electronics Industry.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Parts & Supplies | Circuit Board Assembly Products
1) 160*100mm, FR-4 CTI ≥ 600V 2) 8 layer impedance control 3) Copper weight(finished inner/outer): 1 oz 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/heat-treatments
. A highly buffed screw will have the appearance of a chrome plated screw. The best way to test for chrome is to apply a solution of copper sulphate
.gif)
