| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
high-temperature interdiffusion, now called the Kirkendall Effect. This phenomenon supported the idea that atomic diffusion occurs through vacancy exchange
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
a connector and will even vary within a single barrel based on geometry (Figure 2 a,b). Specifically, the knee of the PTH barrel will dissolve at a faster rate as compared to the annular ring and/or barrel wall5. This is explained by atomic diffusion
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
high-temperature interdiffusion, now called the Kirkendall Effect. This phenomenon supported the idea that atomic diffusion occurs through vacancy exchange
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Dissolved Gas Spreads Out Through Diffusion. Board The dissolved gas spreads throughout medium by diffusion. When it reaches the edge it escapes through outgassing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/materials-and-composites
& Diffusion Bonding Cintered Metal Powders The photographic and acoustic scanned animated images below demonstrate how our technology makes it easier to inspect and detect defects
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. Introduction to MSD Control MSDs are electronic devices encapsulated with plastic compounds and other organic materials. Moisture from atmospheric humidity will enter permeable packaging materials by diffusion and preferentially collect at the dissimilar material interfaces
| https://www.eptac.com/soldertips/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. This reaction is the creation of the intermetallic layer, which is identified as a compound of Cu3Sn, which transforms again to Cu6Sn5 through liquid state and solid state diffusion
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint
. This reaction is the creation of the intermetallic layer, which is identified as a compound of Cu3Sn, which transforms again to Cu6Sn5 through liquid state and solid state diffusion
| https://www.eptac.com/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. This reaction is the creation of the intermetallic layer, which is identified as a compound of Cu3Sn, which transforms again to Cu6Sn5 through liquid state and solid state diffusion
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