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Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol
Hermetically Sealed SMD Tantalum Capacitors Hermetically Sealed SMD Tantalum Capacitors by: I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek; AVX Corporation The article presents improvement of stability parameters of tantalum surface mounted
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Optical and acoustic images showing voids. Ball Grid Array Optical and acoustic images showing voids in the die attach. Stacked Die Optical and acoustic images showing cracks
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. First of all, the reflow soldering process is used in the assembly of hybrid integrated circuit boards. Most of the components assembled and soldered are chip capacitors, chip inductors, surface mount transistors and diodes
