Safely Singulate Tab Routed Panels - With Dust Extraction Finish routing a tab routed PCB for singulation is a relatively slow process . However, in some cases, where the board contours and sensitive or overhanging components may require, this may b
If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu
Electronics Forum | Mon Dec 31 03:51:14 EST 2001 | hany_khoga
Dear all: We had a severe curvature in our boards after wave soldering.Could a second pass in the wavesolder m/c reduce this curvature. If not then what do you recommend to solve this problem. Also how it can be avoided. Best Regards Hany
Electronics Forum | Mon Dec 31 08:11:23 EST 2001 | hany_khoga
Dear all : We are suffering a severe curvature in our boards when coming out of the wave solder m/c. An Engineer suggested to enter them again for a second pass in the m/c expecting board were thermally mistreated just after the W.S. Can this real
Industry News | 2006-04-17 16:53:02.0
Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2021-08-18 01:24:20.0
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate.
Technical Library | 2018-10-18 15:41:45.0
One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with electronics, the In Mold Electronics (IME) adds compelling new product functionality. Many of these products have multi-dimensional features and therefore require thermoforming processes in order to prepare the labels before they are in-molded. While thermoforming is not a novel technique for IML, the addition of printed electronic functional traces is not well documented. There is little or no published work on printed circuit performance and design interactions in the thermoforming process that could inform improved IME product designs. A general full factorial Design of Experiments (DOE) was used to analyze the electrical performance of the conductive silver ink trace/polycarbonate substrate system. Variables of interest include trace width, height of draw, and radii of both top and bottom curvatures in the draw area. Thermoforming tooling inserts were fabricated for eight treatment combinations of these variables. Each sample has one control and two formed strips. Electrical measurements were taken of the printed traces on the polymer sheets pre- and post- forming with a custom fixture to evaluate the effect on resistance. The design parameters found to be significant were draw height and bottom radius, with increased draw and smaller bottom curvature radii both contributing to the circuits’ resistance degradation. Over the ranges evaluated, the top curvature radii had no effect on circuit resistance. Interactions were present, demonstrating that circuit and thermoforming design parameters need to be studied as a system. While significant insight impacting product development was captured further work will be executed to evaluate different ink and substrate material sets, process variables, and their role in IME.
SMTnet Express, December 21, 2017, Subscribers: 31,120, Companies: 10,825, Users: 24,210 Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven Rd K . Khirotdin, Nurhafizzah Hassan, Hi H. Siang
