SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
Conductive adhesives increase microchip packaging density Conductive Adhesives Increase Microchip Packaging Density Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs
SMTnet Express, October 10, 2013, Subscribers: 26313, Members: Companies: 13481, Users: 35260 Printed Circuit Board Technology Inspired Stretchable Circuits. by J. Vanfleteren, M. Gonzalez, F. Bossuyt, Y.-Y. Hsu, T. Vervust, I. De Wolf, M
