Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
GenX Series X-ray Inspection Systems The new GenX series x-ray inspection systems come in three model choices corresponding to the power level of their specific x-ray source and can be configured with various detectors to provide a wide range of hi
New Equipment | Rework & Repair Equipment
The Hakko FX-888D is an updated digital version of the popular FX-888 and includes several new features. User selectable preset temperatures and digital calibration simplify user setup and operation, and the new password protection and low temperatur
Electronics Forum | Sun Jan 18 09:38:34 EST 2004 | m_imtiaz
we are facing cold joint problem in selected component please advise me possiblity of this problem imtiaz
Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef
Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Parts & Supplies | SMD Placement Machines
0102004 ROLLER 0104008 Bracket 0104009 shaft 0104018 block 0105001 shaft 0101111 PIN 0102102 PIN 0103012 SPRING 0105003 plate 0105004 spring 0105005 plate 0105008 Tube Canvil 0109035 STOPPER 0109036 STOPPER 0101020 WASHER 0101008 PIN 00420056 PIN 010
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
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Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Career Center | la jolla, California USA | Engineering
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| https://www.eptac.com/5-common-solder-mistakes-and-how-to-resolve-them/
. 4. Cold Solder Joint A cold solder joint occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_to-neck-or-not-to-neck-that-is-the-question_topic2025.xml
. You might think that large traces might conduct heat away from the solder joint producing a cold solder joint. But I learned back in 1982 from senior PCB designers that a cold solder joint can only be produced by a copper area larger than the size of a USA Quarter $0.25 - 0.955 inches (24.26 mm