Industry Directory | Manufacturer
OCTO, powered by CERcuits, provides ceramic PCB & substrates to the electronics industry. We develop and manufacture alumina PCB, aluminum nitride PCB, heat plates and other substrates. Get quotes & order online at our OCTO portal
Industry Directory | Manufacturer
Manufacturers of Custom Thick Film Ceramic Substrates, Chip Resistors and Attenuators
New Equipment | Board Handling - Conveyors
Multi-use SMEMA-compatible pass-through SMT conveyor and PCB linking conveyor for PCB printed circuit board, this is the belt Edge Conveyors are specifically designed for transporting PCBs, BGA flex arrays, MCMs, and ceramic substrates with electroni
New Equipment | Board Handling - Conveyors
Printed circut board pcb conveyor belt Edge Conveyors are specifically designed for transporting PCBs, BGA flex arrays, MCMs, and ceramic substrates with electronic assembly, test, and inspection equipment. Available in standard or custom designs and
Electronics Forum | Wed Aug 22 21:00:41 EDT 2001 | dlkearns1
Yes, it is very true and very clean SNAP!
Electronics Forum | Wed Aug 22 18:51:48 EDT 2001 | stefo
Hi ya'll, We may be getting some business here for a small (2" X 2"),ceramic substrated, double-sided SMT assembly. I've done ceramic substrates with SMT in the past, but not double-sided, and as packed as this thing will be... My question is, can
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM602-L Product number: CM602-L Detailed product introduction Substrate size: L50 mm x W50 mm ~L510 mm W460 mm x High speed mounting head: 12 suction nozzle (ceramic) (white) Mounting speed: 0.036
Industry News | 2012-07-17 20:55:30.0
First Step in IPC’s Printed Electronics Initiative to Help Industry Grow
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
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Parts & Supplies | SMT Equipment
00357288-01 FUSE 5x20 10A WITH DELAY 00357289-01 FUSE 5x20 / T 1,6A / Glas 00357328-01 BACKPLANE KSP-SYSS23 00357744S01 Adapter e156 00357795S01 PNEUMATIC-SERVICING-UNIT 00357871-01 SOCKET PROTECTION TEDDY 6310 WHITE 00357969-02 Velcro Tape for
Technical Library | 2023-05-10 01:39:38.0
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film.
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
00357288-01 FUSE 5x20 10A WITH DELAY 00357289-01 FUSE 5x20 / T 1,6A / Glas 00357328-01 BACKPLANE KSP-SYSS23 00357744S01 Adapter e156 00357795S01 PNEUMATIC-SERVICING-UNIT 00357871-01 SOCKET PROTECTION TEDDY 6310 WHITE 00357969-02 Velcro Tape for
https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. Generally, the thermal conductive paste will be applied to contact with the thermal conductive part. Currently there are ceramic substrates and so on. ② Copper substrate
ASCEN Technology | https://www.ascen.ltd/Blog/machine/PCB_conveyor/
ceramic substrates with electronic assembly, test, and inspection equipment. Available in standard or custom de... Read more multi function PCB conveyor connect the auto PCB online loader multi function pcb conveyor connect auto pcb online loader with slip-roller design for accumulation, and precise product movement
