Industry Directory | Manufacturer
Supplier of High-Tech Low-Cost Printed Circuit Boards with 1-48 layers from 24h express. Flex, flex-rigid, metal core, impedance control, blind & buried vias as well as SMD Stencils.
Industry Directory | Consultant / Service Provider / Manufacturer
Electronics Manufacturing Services (EMS) including printed circuit board assembly, with specialties in surface mount and through-hole LED circuit board assemblies.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
New Equipment | Assembly Services
SMT board loading machine parameters It has the advantages of simple operation, reliable structure, excellent material selection and high quality. Product specification: weight: 65kg Power supply voltage: single 220 V (or 110 V) Power: ≤ 50W
Electronics Forum | Wed Nov 23 08:43:48 EST 2022 | charles_nguyen
I am having problem with plated hole-copper spacing. I don't know if the gap between plated hole and copper can meet the capacity of PCB manufacturers. My board have 0.5oz copper weight on outer layer and distance of 0.177MM between plated hole and c
Electronics Forum | Wed Mar 19 09:54:44 EDT 2008 | davef
Here's what we suggest: * Keep a 5-mm space between a board edge and a ceramic capacitor. * Mount the capacitor parallel relative to the edge. * Design pads about a half of the termination. * Fixture the board when using your pizza cutter.
.jpg)
Used SMT Equipment | Conveyors
Lot includes: (1) Panasonic Vacuum Style Bare Board Loader (1) Panasonic .5m Conveyor (1) Panasonic Workstation Conveyor (1) Panasonic Shuttle Gate (1) Panasonic Turn Unit (1) Panasonic Long (110") Transfer Conveyor (1) Panasonic Transfe
Used SMT Equipment | Soldering - Reflow
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformi
Industry News | 2003-03-06 08:10:20.0
Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
Parts & Supplies | SMT Equipment
SM471 board AM03-001815C More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Feeder upper cover J7
Parts & Supplies | Circuit Board Assembly Products
JUKI 750 board card More SMT JUKI feeder parts in stock E1506706000 Juki Feeder Spring E2300706000 JUKI 16MM Feeder Spring E3245760000 JUKI Ratchet SP 32MM Feeder Spring E3306706000A JUKI FF 12MM Feeder Winding Reel E3335706000 Juk
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Thu Apr 07 00:00:00 EDT 2022 - Thu Apr 07 00:00:00 EDT 2022 | Palm Bay, Florida USA
Space Coast Chapter Technical Meeting: Printed Wiring Board Fabrication Design Attributes
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Littleton, Colorado USA | Engineering
At Lockheed Martin, everything is possible. We're a global security and aerospace company continually recognized as one of the top Space Systems employers in the industry. As a Technician with Lockheed Martin you will be involved in the manufacturi
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/spacing-of-adjacent-holes_topic2044_post8378.html
Spacing of Adjacent Holes - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login Spacing of Adjacent Holes
Imagineering, Inc. | https://www.pcbnet.com/blog/considerations-for-pcb-board-design-layout/
: Rules pertaining to the board itself, such as via sizes and trace width. Spacing: Rules pertaining to the distance and clearance between power tracks
