Technical Library | 2023-11-07 09:36:38.0
How to Choose the Right PCB Coating Machine Line Selecting the ideal equipment for your PCB coating line can be a complex task. In this article, we will guide you through the critical components of a standard PCB coating machine line and their solutions to common challenges. We'll delve into the line's composition, including the elevator, transfer station, coating machine, inspection station, curing oven, and their interconnectedness through a return conveyor. Let's explore each element and understand its role. Components of a PCB Coating Machine Line: Elevator: The PCB coating process starts with an elevator, efficiently transporting PCB boards to the next stage. Transfer Station: After the elevator, boards are conveyed to a transfer station, preparing them for the coating process. Coating Machine: The heart of the PCB coating line is the coating machine. We offer a range of coating machines, including I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650. Inspection Conveyor: Following the coating process, the boards move to an inspection station. The second transfer station is equipped with LED lights and a blue glass cover, enabling operators to closely inspect the coating quality. This feature is vital for ensuring consistent, dust-free coatings. Curing Oven: For UV-curable adhesives, we provide a UV curing oven to effectively solidify the adhesive. Return Conveyor: Beneath the entire line runs a return conveyor, connected to the elevator. This conveyor system efficiently returns PCBs from the last elevator to the first one, reducing manual handling and streamlining operations. The Advantages of the PCB Coating Line Design: 1. Easy Accessibility: The operator's station is strategically located beside the coating machine, ensuring easy access for setup and adjustments. 2. Enhanced Efficiency: The integrated return conveyor eliminates the need for manual transport, optimizing workflow. 3. Quality Control: The inspection station with the blue glass cover enables operators to inspect coatings for quality and cleanliness. 4. Dust Prevention: The blue glass cover also serves as a barrier to prevent dust contamination on freshly coated PCBs. Selecting the right PCB coating machine line is essential for achieving quality and efficiency in your operations. Our meticulously designed equipment line, along with its well-engineered components, can help you attain superior results. If you have further questions or need assistance in choosing the best solution for your specific requirements, please do not hesitate to contact us. We are committed to providing solutions that meet your needs and exceed your expectations.
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
Technical Library | 2021-03-10 23:57:29.0
Latent short circuit failures have been observed during testing of Printed Circuit Boards (PCB) for power distribution of spacecraft of the European Space Agency. Root cause analysis indicates that foreign fibers may have contaminated the PCB laminate. These fibers can provide a pathway for electromigration if they bridge the clearance between nets of different potential in the presence of humidity attracted by the hygroscopic laminate resin. PCB manufacturers report poor yield caused by contamination embedded in laminate. Inspections show ...
Technical Library | 2014-02-06 17:49:48.0
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.
Technical Library | 2010-09-09 16:44:48.0
The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see if they have stayed clean as a result of the washing process.
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
Technical Library | 2021-04-29 01:43:34.0
Since the 1980s the electronics industry has utilized ion chromatography (IC) analysis to understand the relationship of ions, and some organics, to product reliability. From component and board fabrication to complete electronic assemblies and their end-use environment, IC analysis has been the de facto method for evaluating ionic cleanliness of electronic hardware.
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
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