| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. Being able to identify and quickly resolve them is vital to ensuring production schedules are kept, and future errors are avoided. To assist in recognizing these errors, below is a list of five common solder mistakes and how to resolve them. 1. Disturbed Joint A disturbed joint
| https://www.wesource.com/solder-paste-and-pcb-inspection-machines/tri-tr7006l-3d-solder-paste-inspection-machine-id-140370/
) 220V The TR7006 three-dimensional Solder Paste Inspection System tester can quickly detect the thickness of every solder joint and any open or short circuits
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post11220.html
causing solder protrusion. 2. When the solder goes into the vias, it robs the thermal pad from having the optimal solder joint. Less solder = bad connection. 3. The thinner PCB thickness of 1 mm can be problematic because it's easier for the solder to flow out the bottom side and could cause shorting
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154_post10556.html
causing solder protrusion. 2. When the solder goes into the vias, it robs the thermal pad from having the optimal solder joint. Less solder = bad connection. 3. The thinner PCB thickness of 1 mm can be problematic because it's easier for the solder to flow out the bottom side and could cause shorting
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2154&OB=ASC.html
causing solder protrusion. 2. When the solder goes into the vias, it robs the thermal pad from having the optimal solder joint. Less solder = bad connection. 3. The thinner PCB thickness of 1 mm can be problematic because it's easier for the solder to flow out the bottom side and could cause shorting
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
during reflow resulting in bubble-like inclusions in the final reflowed solder joint. Voids are metastable, in that the combination of forces present - both on the surface of the void (energy from the surface tension measured in N/m or J/m2), and
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-aluminum-wire
. You need an aggressive flux, a high activity flux with activators, such as an ORH1 flux. This flux is very active and cleaning is a must to removed the residual fluxes left behind after the solder joint is created, and in your case, after the shield is soldered
| https://www.eptac.com/ask/soldering-aluminum-wire/
. You need an aggressive flux, a high activity flux with activators, such as an ORH1 flux. This flux is very active and cleaning is a must to removed the residual fluxes left behind after the solder joint is created, and in your case, after the shield is soldered
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
(non-shiny) solder joints are usually the effect of coarse grain structure in the solid solder joint (though there can be other causes
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. Reflow soldering oven characteristics Basic requirements for reflow soldering ovne: Proper heat 2. Good wetting; 3. Proper solder joint size and shape; 4
