Industry News: backplane connectors (Page 1 of 4)

Teradyne Expands Presence in China and Opens Shanghai Facility

Industry News | 2003-03-12 09:10:10.0

As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.

SMTnet

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

Receptacle Makes Room for Drive Mounting

Industry News | 2003-02-26 08:37:36.0

An extended-height press-fit compliant pin SCA-2 receptacle is the latest addition to the SCA-2 product family.

SMTnet

DIN Connectors Have All Applications Covered

Industry News | 2003-06-17 08:50:16.0

The CECC-approved DIN EN60603-2 (DIN41612) Series is ideal for electronics equipment requiring reliable yet inexpensive circuit board interconnection.

SMTnet

IPC Assembly Quality Benchmark Study Open to Participants, Survey Deadline Extended to April 30

Industry News | 2018-04-24 08:50:23.0

The annual Quality Benchmark Study for Electronics Assembly, one of IPC’s most popular studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation has been extended to April 30.

Association Connecting Electronics Industries (IPC)

IPC Releases 2002/2003 Technology Roadmap

Industry News | 2003-05-08 07:04:57.0

Provides Industry with Strategic Assistance for the Future

Association Connecting Electronics Industries (IPC)

IPC Releases 2017 Quality Benchmark Study for Electronics Assembly

Industry News | 2017-10-05 05:41:24.0

IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

Association Connecting Electronics Industries (IPC)

IPC Assembly Quality Benchmark Survey Open to Participants Worldwide

Industry News | 2019-04-24 18:56:07.0

The 2019 Study of Quality Benchmarks for Electronics Assembly, one of IPC’s most popular annual studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation is May 17.

Association Connecting Electronics Industries (IPC)

Orbotech Announces New President

Industry News | 2003-01-27 09:36:56.0

Greater AOI Capabilities

Orbotech

ViTrox Technologies Releases High-Throughput AOI Solution — V510 G2 Series

Industry News | 2012-07-18 10:12:06.0

ViTrox Technologies,introduces the G2 Series of its V510 Advanced Optical Inspection (AOI) solution. The V510 G2 Series offers powerful technologies and high-throughput productivity for SMT line production.

ViTrox Technologies

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