Electronics Forum | Mon Jun 11 10:40:46 EDT 2007 | ramseyn
Jim, Another good resource would be Asymtek (www.asymtek.com) I have had a lot of luck with their dispense equipment for underfilling applications. They have run tests in the past using various methods for our company to determine what type of epoxy
Electronics Forum | Tue Jul 19 15:43:37 EDT 2005 | msjohnston1
We are trying to do a dispenser comparison study between the Asymtek Axiom X1020 with DJ9000 valve and the Camalot XyflexPro system. The system will have a dual purpose for dispensing epoxy dots and underfill. I would like to have comments positive
Electronics Forum | Fri Jul 18 15:04:44 EDT 2003 | pjc
Top Four Dispensing Equipment Companies: Camalot www.cooksonee.com/about/about_camalot.html Asymtek www.asymtek.com GPD www.gpd-global.com Creative Automation www.cacsystems.com All above cos. have applications engineering personnel for underfil
Electronics Forum | Thu Feb 23 14:06:19 EST 2006 | pjc
Positive Displacement Pump technology is in fact used for the underfill process. Both Camalot Systems and Asymtek both use them. Asymtek also has the Jetter and Camalot has the Multi-Piston Pump, specifically designed for underfill applications. The
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Thu Feb 23 08:06:03 EST 2006 | davef
"The three dispensing pumps used for encapsulation are the air/time syringe, rotary positive displacement pump (RPDP) and the linear piston pump. Each of these methods of dispensing offer different attributes but the most accurate method is the linea
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
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