Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to keep up with the rapid deve
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
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