Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
Industry News | 2002-04-24 08:49:13.0
Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months
Industry News | 2008-08-01 00:29:58.0
With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
Industry News | 2018-11-09 12:23:47.0
Feeder Finger, a division of Automation Technical Services, offers cut tape solutions for printed circuit board (PCB) assembly. The company offers productivity enhancing solutions for all major SMT feeders, including Juki, Samsung, Yamaha, Panasonic, Siemens, Essemtec, I-Pulse and ASM.
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2012-08-31 12:32:09.0
Carlsbad, CA – September 1, 2012: Machine Vision Products today announced they would be demonstrating their 850G Inspection solutions at the Semicon Taiwan 2012 exhibition. The exhibition is at the Taipei World Trade Center, Nangang Hall in Taipei, Taiwan from September 5-7 2012. Machine Vision Products are exhibiting on Booth #960 with Sigmatek Corp.
Industry News | 2008-07-14 14:42:19.0
Carlsbad, CA (July 14, 2008) -- Machine Vision Products, Inc. A worldwide leader in Automated Optical inspection for the Micro-electronics, Semiconductor and SMT manufacturing industries today announced that it has received its 75th system order for its recently-introduced Ultra 850G Packaging and Micro-electronics Automated Optical Inspection (Micro-electronics AOI) platform. These orders reflect the success of this product in providing unique defect coverage and metrology in the Flux, Paste, Die Placement, Component and Underfill processes.
