Industry Directory | Manufacturer
Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.
Industry Directory | Manufacturer
Manufacturing of ESD shielding bag/film, aluminum foil bag/film, nylon vacuum bag/film, pink PE film, Conductive film for electronics packaging.
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
New Equipment | Assembly Services
High Frequency PCB Material: SYTECH Layer Count: 4 layers PCB Thickness: 1.6mm Min. Trace / Space Outer: 0.1mm/0.1mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG+OSP Product Features 1. DK needs to be tiny as well
Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber
The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen
Electronics Forum | Tue Apr 27 16:37:16 EDT 2004 | babe
Well I would think that the heat slug would work to a point. Obviously made to dissipate heat from the component. That said it wouldn't hurt to cover that also with aluminum foil. Your not wrapping a present, your simply tenting the component. IR wil
Industry News | 2003-02-21 08:53:41.0
Gould Electronics Inc. said that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003.
Industry News | 2013-02-13 11:35:03.0
The QTS Wizard Frame Quick Tensioning system will be on display in the HITACHI HP-07 Printer at IPC/APEX 2013, in booth #2440. The Wizard Stencil Stretch Frame System is designed to save time, costs, shipping, and waste over the old labor-intensive industry method of assembling custom cast aluminum or tubular frames and stencil foils.
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
SMTnet Express, July 7, 2016, Subscribers: 25,539, Companies: 14,860, Users: 40,631 Dissolution of Metal Foils in Common Beverages Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim
SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX
ORION Industries | http://orionindustries.com/q-pad.php
2.5 W/m-K for Q-Pad II, 2.0 W/m-K for Q-pad 3. Q-Pad II, is a composite of 0.0015" aluminum foil, sandwiched between two layers of sil-pad rubber
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2015-01-05
Die on an Existing Coating Line, Thickness Tolerances Were Narrowed by 50 to 60% CHUNGBUK, SOUTH KOREA, January 5, 2015: An advanced extrusion coating die designed to reduce edge bead has enabled one leading producer of aluminum foil and foil-laminate flexible packaging to actually eliminate edge bead, as well as
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